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US Patent Issued to KYOCERA on April 7 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,700, issued on April 7, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board" was invented by Hiroaki Sano (Kagoshima, Japan), Toshi... Read More


US Patent Issued to NANYA TECHNOLOGY on April 7 for "Semiconductor device with selection structure and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,701, issued on April 7, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with selection structure an... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on April 7 for "Printed circuit board" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,702, issued on April 7, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More


US Patent Issued to NITTO DENKO on April 7 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,703, issued on April 7, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Shusaku Shibata (Osaka, Ja... Read More


US Patent Issued to Hyundai Mobis on April 7 for "Apparatus and method for manufacturing power module" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,704, issued on April 7, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Apparatus and method for manufacturing power module" ... Read More


US Patent Issued to NICHIA on April 7 for "Wiring board, light emitting device, and method for manufacturing thereof" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,705, issued on April 7, was assigned to NICHIA Corp. (Anan, Japan). "Wiring board, light emitting device, and method for manufacturing ther... Read More


US Patent Issued to Fitech Sp. z on April 7 for "Method of inserting an electronic components in through-hole technology, THT, into a printed circuit board, PCB, by an industrial robot" (Polish Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,706, issued on April 7, was assigned to Fitech Sp. z o.o. (Sucha Beskidzka, Poland). "Method of inserting an electronic components in throu... Read More


US Patent Issued to TSE on April 7 for "Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,707, issued on April 7, was assigned to TSE Co. LTD. (Cheonan-si, South Korea). "Method of manufacturing multi-layer circuit board includin... Read More


US Patent Issued to Caterpillar on April 7 for "Detachable sensor assembly for an elongate conductor" (Indian, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,708, issued on April 7, was assigned to Caterpillar Inc. (Peoria, Ill.). "Detachable sensor assembly for an elongate conductor" was invente... Read More


US Patent Issued to HONOR DEVICE on April 7 for "Terminal device" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,710, issued on April 7, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China). "Terminal device" was invented by Wei Li (Shenzhen, China)... Read More